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- Helios Nano Lab 600
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- Hitachi S-4700 FESEM
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Helios Nano Lab 600: Capabilities
FEI Helios NanoLab 600 FIB/FESEM is intended for a simultaneous site-specific FIB cross-sectioning and high resolution nondestructive SEM imaging. It is equipped with a STEM detector for STEM imaging and an Omniprobe (AutoProbe 200.2) nanomanipulator for high-accuracy nanomanipulation. The instrument is capable of nanoscale Platinum deposition, patterning, lithography, and TEM cross-section specimen preparation.
An Oxford Energy Dispersive Spectrometer (EDS) and an HKL Electron Backscatter Diffraction (EBSD) system for composition and orientation analyses were installed in March 2009.
Other accessories include:
- Gas Injector System- deposition or etching, capable of five different gas chemistries delivering.
- FEI AutoFIB Software Package- multiple-site automated FIB routine.
- FEI AutoSlice and View Software Package- serial sectioning and imaging across a site-specific volume. The slices can be merged into a video or as the input for 3-dimensional reconstruction.
- FEI AutoTEM G2 Software Package- TEM cross-sectional specimen preparation.
- Electron source: Schottky thermal field emitter
- SEM beam voltage: 350 V - 30 kV
- SEM resolution (coincident point): < 1 nm @ 15 kV; 1.6 nm @ 5 kV
- Ion source: Gallium liquid metal
- FIB beam voltage: 500 V - 30 kV
- FIB resolution (coincident point): 5 nm @ 30 kV
- STEM resolution: 0.8 nm
- EDS resolution: < 30 nm on thinned samples
- Maximum sample size: 150mm in diameter with full rotation
- Maximum sample thickness: 20mm at 7mm working distance
Direct questions to Jingjing Qing