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FEI Helios NanoLab 600 FIB/FESEM is intended for a simultaneous site-specific FIB cross-sectioning and high resolution nondestructive SEM imaging.  It is equipped with a STEM detector for STEM imaging and an Omniprobe (AutoProbe 200.2) nanomanipulator for high-accuracy nanomanipulation.  The instrument is capable of nanoscale Platinum deposition, patterning, lithography, and TEM cross-section specimen preparation.  

An Oxford Energy Dispersive Spectrometer (EDS) and an HKL Electron Backscatter Diffraction (EBSD) system for composition and orientation analyses were installed in March 2009.

 

 

Other accessories include:

• Gas Injector System- deposition or etching, capable of five different gas chemistries delivering.
• FEI AutoFIB Software Package- multiple-site automated FIB routine.
• FEI AutoSlice and View Software Package- serial sectioning and imaging across a site-specific volume. The slices can be merged into a video or as the input for 3-dimensional reconstruction.
• FEI AutoTEM G2 Software Package- TEM cross-sectional specimen preparation.

 

Specification:

• Electron source: Schottky thermal field emitter
• SEM beam voltage: 350 V - 30 kV
• SEM resolution (coincident point): < 1 nm @ 15 kV; 1.6 nm @ 5 kV
• Ion source: Gallium liquid metal
• FIB beam voltage: 500 V - 30 kV
• FIB resolution (coincident point): 5 nm @ 30 kV
• STEM resolution: 0.8 nm
• EDS resolution: < 30 nm on thinned samples
• Maximum sample size: 150mm in diameter with full rotation
• Maximum sample thickness: 20mm at 7mm working distance

 

 

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